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Microelectronic Package
Product Description
Computer CPU,DSC chips
Integrated Circuit Package Housings
Carriers
Radar Microwave modules
Semiconductor Wafers
Electronic Communications Devices
Materials:Silicon Aluminum Alloys(AlSi Alloys)
Configuration:Platforms,Plug-ins,Flatpacks,TO Headers etc.
Advantages
CTE match to circuit boards and components;
High thermal conductivity and outstanding heat dissipation;
Low density;
Hermeticity;
Dimensional stability;
Corrosion Resistance;
Wafer Level Packaging;
Ease of manufacture.
AlSi Alloys Performance Parameters
Content Density
g/cm³ CTE
ppm/℃ Thermal Conductivity
W/mK Tensile Strength
MPa Yield Strength
MPa Poisson's Ratio Elongation
% Elastic Modulus
GPa
Al-27%Si 2.6 17 175 170 130 0.29 3.8 91
Al-42%Si 2.55 13.5 160 200 187 0.29 1 105
Al-50%Si 2.5 11.5 140 220 210 0.28 <1 108
Al-60%Si 2.46 10 125 210 210 0.27 <1 111
Al-70%Si 2.43 7.5 120 135 135 0.27 <1 114
Microelectronic Package